In industries where even 1°C of excess heat can compromise performance or safety, high thermal conductivity copper components are non-negotiable. Traditional manufacturing struggles to deliver parts that combine maximum heat transfer with complex geometries—until XiaoJiao’s high thermal conductivity copper printing technology. By leveraging advanced 3D printing processes, we produce copper parts with thermal conductivity exceeding 390 W/m·K (pure copper’s theoretical maximum), redefining thermal management in electronics, aerospace, and energy systems.

Why Thermal Conductivity Matters—And How 3D Printing Makes It Better

Thermal conductivity (measured in W/m·K) determines how quickly heat moves through a material. For critical applications:

· Electronics: AI chips and power semiconductors require >350 W/m·K to prevent overheating and performance throttling.

· Aerospace: Satellite and rocket components need rapid heat dissipation to survive extreme temperature swings (-270°C to 1,000°C).

· Energy Systems: Hydrogen fuel cells and EV batteries rely on efficient heat transfer to maintain efficiency and safety.

Traditional copper manufacturing falls short:

· Machining: Creates dense, solid structures with limited surface area for heat exchange; conductivity drops by 10-15% due to tool-induced stress.

· Casting: Introduces porosity and impurities, reducing thermal efficiency by up to 20%.

· Welding: Joints act as thermal barriers, creating hotspots in high-power assemblies.

XiaoJiao’s