How Xiaojiao leads custom copper 3D printing thermal management

As electronic devices continue to achieve breakthroughs in performance, heat dissipation efficiency has become a key factor in determining product reliability and lifespan. Traditional cooling solutions are increasingly struggling to cope with high-heat generation scenarios such as 5G base stations and new energy vehicle motor controllers. However, Xiaojiao is redefining the possibilities of thermal management through copper 3D printing technology.

1. 3D Printed Copper Heatsinks:

A Technological Revolution Breaking Through Traditional Heat Dissipation Copper is an ideal material for heat dissipation due to its ultra-high thermal conductivity (over 390 W/m·K) and electrical conductivity. However, traditional processing methods (such as cutting and casting) struggle to achieve complex internal structures, limiting heat dissipation area and fluid dynamics optimization.

Xiaojiao utilizes Selective Green Laser Melting (SLM) technology to directly print:

l Bionic topological structures: such as fractal flow channels and vortex enhancement designs, increase heat dissipation area by 300% and reduce pressure drop by 40%.

l Microchannel arrays: With channel widths less than 0.3mm, combined with conformal cooling, thermal resistance can be reduced to 0.08°C/W (compared to 0.15°C/W for traditional fins).

l Integrated: Combining the heat sink with the power device package reduces interfacial thermal resistance while achieving a 35% weight reduction.

Case study on 3D printing of copper heat sink: After adopting Xiaojiao's solution in the AAU heat dissipation module of a 5G base station, the chip junction temperature was reduced by 18°C and power consumption was reduced by 25%.

2. Xiaojiao's Technological Advantages: Full-Chain Innovation from Materials to Processes

(1) Material Selection and Purity Control

l High-purity oxygen-free copper (99.95%): Thermal conductivity approaches that of wrought copper, ensuring efficient heat transfer.

l Customized copper alloys: For example, CuCr1Zr alloy offers both high strength and moderate thermal conductivity, suitable for use in extreme environments such as rocket engines.

(2) Process Precision and Reliability

l Green Laser Technology: The 515nm wavelength increases the copper powder absorptivity to 40-50%, enabling 99.9% print density and a surface roughness of Ra <5μm.

l Vacuum Pre-Circulation System: Removes oxygen and moisture from the powder before printing, preventing oxidation from affecting thermal conductivity.

(3) Rapid Response and Cost Optimization

l Small-Batch Economy: Eliminating mold costs, single-batch production costs are 40% lower than traditional processes.