3D Printed Liquid Cold Plate (Pure Copper): Unlocking New Cooling Dimensions

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Why Traditional Liquid Cold Plates Struggle with High-Density Cooling?

In high-density cooling scenarios like new energy vehicle battery packs, high-power charging piles, and data center servers, liquid cold plates are core to temperature control. However, traditional pure copper liquid cold plates face cooling bottlenecks due to manufacturing limitations:

 

 Rigid Channel Design: Welded or machined cold plates have internal flow channels limited to simple straight lines or right-angle turns, causing uneven coolant flow and local thermal resistance exceeding 0.15℃/W.

 Sealing Risks: Multi-component splicing creates over 10 welds, leading to a yearly leakage rate of over 5% under high-pressure (≥3bar) coolant impact, risking equipment short circuits.

 Low Material Efficiency: To cover heat sources, traditional cold plates often use large solid structures, with pure copper usage exceeding 30% and increasing equipment weight.

 

3D printed pure copper liquid cold plates redefine liquid cooling efficiency and reliability through integrated molding.


 

Three Breakthrough Advantages of 3D Printed Pure Copper Liquid Cold Plates

Targeting traditional pain points, 3D printed pure copper liquid cold plates achieve qualitative leaps through "structural freedom + material purity":

1.Bio-Inspired Flow Channel Network

Mold free 3D printing achieves vein like bifurcation with gradient cross-section and turbulent channel (adjustable diameter 0.5-3mm) protrusion,boosting coolant heat exchange efficiency by 40%. In 100kW battery pack tests, temperature difference is controlled within ±2℃, far better than ±5℃ of traditional plates.

2.Integrated Molding for Zero Leakage

The entire cold plate (channels, inlets/outlets, sealing surfaces) is printed in one pass from pure copper powder, with zero welds. Tested at 10bar pressure, leakage rate is 0, eliminating sealing issues of traditional splicing—ideal for automotive electronics requiring IP6K9K protection.

3.Lightweight & Precision Fit

Topology optimization reduces non-essential copper by 50% while maintaining cooling area, cutting weight by 25% vs. traditional plates. Custom contours (e.g., fitting battery module curves) lower contact resistance to 0.02℃/W.

 

Xiaojiao's 3D Printed Pure Copper Liquid Cold Plate Solutions

Xiaojiao specializes in translating 3D printing into practical cooling performance, with core capabilities:

 Patented Green Laser Technology:515-560nm laser achieves 45% absorption on pure copper powder, ensuring channel inner wall smoothness (Ra≤1.6μm) and 15% lower coolant resistance vs. traditional machined channels.

 Material Purity Guarantee:99.95% high-purity electrolytic copper powder yields 99.96% density after printing, maintaining 390W/m·K thermal conductivity (near forged copper levels) to avoid impurity-induced cooling loss.

 End-to-End Simulation Validation:CFD flow + thermal simulation optimize channel layout (inlet/outlet positions, split ratios), ensuring first samples meet cooling targets.

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